Thermal management in 3D ICs directly affects design performance, reliability and lifetime. As multiple dies are stacked within a smaller space, power density
The semiconductor industry is on track to hit a $1 trillion valuation by 2030. While surging demand drives impressive growth, many chipmakers face
The Solido Custom IC Design team has been working hard to bring you tips & tricks to perfect your tool experience while improving
Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software category.
On June 26, 2026, CEO of VBTECH, Mrs Dam Thi Hong Lan attended the launch ceremony of the Vietnam National Multi-Project Wafer Coordination
On April 11, 2026, within the framework of the Semiconductor Future Summit – “Inside the Chip – Inside the Future” held at FPT
Unlocking the power of Cloud and AI in industrial design and manufacturing with NX X640 views
VBTECH signs MOU with Gachon University Vietnam at Semiconductor Future Summit616 views
Xpedition Standard: Shortening PCB Design Cycles by Up to 50%129 views
CEO VBTECH Attends the SemiExpo Vietnam 2026 Launch Event107 views
