Can AI Run a Factory on Its Own? Siemens and NVIDIA’s Latest Breakthrough

Discover how Siemens and NVIDIA are transforming manufacturing with Industrial AI, Digital Twins, and autonomous production planning.

20 October, 2026

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CIMCO Edit Core and Ultra – Advancing CNC Programming, Simulation, and NC Program Verification

Compare CIMCO Edit Core and Ultra for NC program editing, toolpath visualization, 3D material removal simulation, collision detection, and CNC program verification

14 October, 2026

Calibre Vision AI – AI-Powered Acceleration for DRC Analysis and Debug in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages of chip development.

12 October, 2026

Siemens EDA AI – Artificial Intelligence for IC and PCB Design

Artificial intelligence is driving significant changes across the electronics design industry. As IC and PCB designs become increasingly complex

9 October, 2026

Digital Twin for Humanoid Robots: From Prototype to Production

Through Siemens Xcelerator, together with Designcenter, Simcenter, Teamcenter and Capital, Siemens is building a connected engineering ecosystem that spans concept development, design and

3 October, 2026

Xpedition Standard: Shortening PCB Design Cycles by Up to 50%

PCB design workflows are becoming increasingly complex as electronic products demand higher component densities, faster signal speeds, and adherence to rigorous technical requirements.

29 September, 2026

CAM350: The Industry-Standard Software Taking PCBs from Design to Manufacturing

Valor CAM350 is a comprehensive, industry-standard toolset for verifying, optimizing, and exporting manufacturing data for printed circuit boards (PCBs).

28 September, 2026

Valor CAM350: The key to faster, more accurate PCB manufacturing

From design data to finished circuit board — Siemens introduces the industry-standard CAM toolset that helps PCB manufacturers verify, optimize, and export production

25 September, 2026

Six Key Trends Redefining 3D IC Packaging in the AI Era

The semiconductor industry is entering an era in which continued performance scaling can no longer rely solely on transistor shrinkage. Chiplets, advanced packaging,

16 September, 2026